We propose a new class of optoelectronic devices in which the optical properties of the active material is enhanced by strain generated from micromechanical structures. As a concrete example, we modeled the emission efficiency of strained germanium supported by a cantilever-like platform. Our simulations indicate that net optical gain is obtainable even in indirect germanium under a substrate biaxial tensile strain of about 1.75% with an electron-hole injection concentration of 9 x 10(18) cm(-3) while direct bandgap germanium becomes available at a strain of 2%. A large wavelength tuning span of 300 nm in the mid-IR range also opens up the possibility of a tunable on-chip germanium biomedical light source.
We demonstrate the monolithic integration of germanium (Ge) p-i-n photodetector (PDs) with silicon (Si) variable optical attenuator (VOAs) based on submicrometer Si rib waveguide. A PD is connected to a VOA along the waveguide via a tap coupler. The PDs exhibit low dark current of ~60 nA and large responsivity of ~0.8 A/W at the reverse bias of 1 V at room temperature. These characteristics are uniform over the chip scale. The PDs generate photocurrents precisely with respect to DC optical power attenuated by the VOAs. Two devices work synchronously for modulated optical signals as well. 3-dB cut-off frequency of the VOA is ~100 MHz, while that of the PD is ~1 GHz. The synchronous response speed is limited by the VOA response speed. This is the first demonstration, to the best of our knowledge, of monolithic integration of Ge PDs with high-carrier-injection-based optical modulation devices based on Si.
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