In this research we proposed, designed, fabricated, and measured a novel Micro Electro Mechanical System (MEMS) based vertical probe tips which differs from conventional cantilever probe tips.The main idea of the vertical probe design was how to distribute the total forces vertically concentrated on the probe tip in measuring semiconductor devices. To solve the problem, we designed the vertical probe tip with meander structure which could provide enough displacements so that the vertical probe tips could distribute the forces acting on the tips. The structural analyses of the probe tip were accomplished using finite element method (FEM) and compared with actual measurement values.The primary fabrication processes were surface micromachining, wafer bonding technology, and electroplating. The material of the electro-plated probe tip was an Ni-Co alloy.In this study, we demonstrated the potential of the vertical probe tip that could apply to a small area with the over drive (O.D.) of 10~40 µm and the contact force of 1~8 gf. The measured contact resistance was less than 2 Ω and little noise was observed.
This paper represents the development of 3-axises loadcell for measuring the side-force of
the suspension module of MPV (Multi Purposed Vehicle). The side force causes the failure of damper,
such as leakage. The loadcell was developed using strain gauges, and the Wheastone bridge circuit to
compensate for the cross-talk between each axises and the measurement error by temperature.
Structure analysis of loadcell was accomplished with FEM (Finite Element Method) to optimize the
location of strain gages. The design optimization for the important factors that have effects on
performance of loadcell was accomplished by using DOE (Design of Experiment). Loadcell was
produced and successfully tested, showing good sensitivity and low cross-talk. The cross-talk of the
developed loadcell is below 2%. The measured history using the manufactured load cell will be
utilized in the vibration, and fatigue analysis in the future.
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