We investigate cutting of transparent materials using ultra short laser pulses with pulse durations in the sub to a few ps regime. All compared methods base on nonlinear absorption including ablation cutting and cleaving or selective etching supported by laser induced modification inside the bulk material. For most of the experiments samples of hardened glass (Corning Gorilla®) with thickness up to 700 µm were used, ablation cutting of sapphire is presented additionally. Absorption and modification inside the volume is analyzed in detail, aiming for tailored modifications. Besides optical microscopy a pump probe setup was used. We show results of time resolved absorption measurements of 6 ps pulses focused into the volume. We observe shielding due to the interaction region and accumulation effects influencing the modifications. First results on inscribing and cutting by using beam shaping indicate the importance of tailoring the shape and arrangement of the pulses temporally and spatially. The results presented for the different cutting methods supports an assessment of the individual potential and a selection of the applicable method based on the requirements
This study presents a novel numerical model for laser ablation and laser damage in glass including beam propagation and nonlinear absorption of multiple incident ultrashort laser pulses. The laser ablation and damage in the glass cutting process with a picosecond pulsed laser was studied. The numerical results were in good agreement with our experimental observations, thereby revealing the damage mechanism induced by laser ablation. Beam propagation effects such as interference, diffraction and refraction, play a major role in the evolution of the crater structure and the damage region. There are three different damage regions, a thin layer and two different kinds of spikes. Moreover, the electronic damage mechanism was verified and distinguished from heat modification using the experimental results with different pulse spatial overlaps.
Processing of thin and ultra-thin glass displays is becoming more important in the fast increasing market of display manufacturing. As conventional technologies such as mechanical scribing followed by manual breaking mostly lead to bad edge quality and thus to a huge amount of reject, other processes like ablation processes with picosecond lasers are getting more and more interesting. However processing with ultrashort pulsed lasers partially leads to unwanted effects which should be understood in a better way by means of intensive basic research. Therefore the ablation mechanism of ultrashort pulses on transparent materials was investigated in this research project. On the one hand the ablation mechanism was analyzed in a simulative way by means of rate equations on the other hand by laboratory experiments
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