Numerical analysis of laser ablation and damage in glass with multiple picosecond laser pulses

Sun, Mingying; Eppelt, Urs; Russ, Simone; Hartmann, Claudia; Siebert, Christof; Zhu, Jianqiang; Schulz, Wolfgang

doi:10.1364/oe.21.007858

Cited by 67 publications

(31 citation statements)

References 22 publications

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“…The volume removed by the 75th laser pulse was calculated to be 30.3 μm 3 by performing a simulation shown in references [18,21]. We calculated the density of free electrons using the simulation and assumed that the energy density of atoms is equal to the product of the density of free electrons and band gap.…”

Section: Stress Simulationmentioning

confidence: 99%

“…where t is time, I is the intensity, k is the number of photons for multi-photon ionization, is the coefficient of multiphoton ionization, c is the coefficient of cascade ionization, rec is the coefficient of recombination, and diff is the coefficient of diffusion [18,27,28]. Because the energy of the free electrons is transferred to phonons, the increase in temperature T can be expressed as follows [29]:…”

Section: Temperature Simulationmentioning

confidence: 99%

“…The main factors contributing to the individual types of damage caused by a single laser shot have been studied extensively [8][9][10][11][12][13][14][15][16]; the shock originating from the photoexcited region generates microscopic cracks, while the high heat leads to modifications in the material. Meanwhile, the damage caused by repeated application of laser beams has been investigated mainly from the aspect of excited electrons [17,18]. Conversely, the damaging effects of shock and high heat during drilling have not been fully researched.…”

Section: Introductionmentioning

confidence: 99%

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Mechanisms of damage formation in glass in the process of femtosecond laser drilling

et al. 2018

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The development of femtosecond lasers has renovated micromachining technology, enabling the microdrilling of transparent materials at high speed. Although effective, this technique is still imperfect because irregular microscopic damage occurs during processing. Several factors in the formation of damage induced by a single laser pulse have been suggested; however, the entire mechanisms of damage formation in the process of drilling are not fully understood. Here we investigated the causes of microscopic damage both by experimentally carrying out laser drilling on chemically strengthened glass samples and by numerically analyzing the propagating stress wave and temperature distribution. We have revealed that the damage at the sidewall and bottom of a generated hole is mainly due to the stress wave, while the damage around the hole entrance is mainly due to relaxation of thermal stress. In particular, we have analyzed these processes quantitatively, demonstrating the time courses of the passage of the stress wave through the material and the temperature distribution generated by the excited electrons. Our analyses are useful in suggesting processing techniques, or suggesting glass materials suitable for laser drilling such as glass with high heat resistance, which may lead to an improvement in the quality of micromachining.

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Section: Stress Simulationmentioning

confidence: 99%

Section: Temperature Simulationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Mechanisms of damage formation in glass in the process of femtosecond laser drilling

et al. 2018

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“…Next, with non-linear absorption of laser beam intensity induced by radiation of the ultra-short pulsed laser, it is expected that the optical properties of materials change in quality because sudden phase conversion from solid to plasma occurs for the most part. As there are two complex dielectric functions, the Drude model or Larentz model is selected [1][2][3][4][5]. In this analysis, in order to express the interaction of laser absorption and target materials, the classic Lorentz model for the bound electron is adapted to the dielectric function.…”

Section: Electric Fields Distribution Formed By Laser Beam Which Sprementioning

confidence: 99%

“…In this analysis, in order to express the interaction of laser absorption and target materials, the classic Lorentz model for the bound electron is adapted to the dielectric function. The complex dielectric function ε is given by [1,2].…”

Section: Electric Fields Distribution Formed By Laser Beam Which Sprementioning

confidence: 99%

Micro Drilling Simulation of Ultra-Short Pulsed Laser Ablation of Glass

Motomura

2015

IJAT

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The purpose of this study is to estimate ablated crater depth with sufficient numerical accuracy when multishot channels of ultra-short pulsed laser are executed for micro drilling processes on thin glass plates. In this analytical model, the plasma model, in which the free electron density and the complex dielectric function of the Lorentz model are evaluated, is applied to estimate the ablated regions and the regions damaged by laser ablation when glass is considered to be a dielectric material. The absorption coefficient and the threshold fluence are important parameters in the evaluation of the ablated crater depth and ablation rate. The parameters obtained in this numerical analysis are in agreement with the experimental results and are computed quantitatively to several laser irradiation conditions. The experimental results and analysis results are examined for multi-shot channels. In an experiment involving laser ablation using multi-shot laser beams, ablation rates for the initial shot are lower than subsequent ablation rates. The effectiveness of the modified absorption coefficient and modified threshold fluence for initial shots is confirmed for the reduction of ablation rate.

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Composition conversion and parameters influence of nanosecond ultraviolet laser cutting polystyrene film

Xin

Wang

Huang

et al. 2021

J of Applied Polymer Sci

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Polystyrene (PS) film has great application potential in the electronics industry, optical instruments, and biomedical equipment, for its excellent optical, insulating, and mechanical properties. The composition conversion mechanism of the nanosecond laser cutting PS film process was studied by Raman and thermal analysis simulation. Raman tests verified that laser cutting would not create new solid by-products and only had an influence on a few chemical bonds. Thermal cracking indicated that the released gas by-product was mainly Benzene derivatives with benzene ring as the main body, which were harmful to human health. Thermogravimetric-infrared combined analysis showed that the weight loss reached maximum rate at 405.73 C and remained basically unchanged after 444.85 C. Moreover, a quality evaluation standard composed of cutting kerf zone and heat-affected zone for nanosecond laser cutting of PS film was established. A three-factor and five-level orthogonal experiment was performed for research the cutting processes, and 2 (190 kHz)-4 (0.4 m/s)-4 (65) was the preferable process parameter combination by analysis comprehensively. Interaction analysis was also conducted to clarify the correlation between laser cutting factors. This work has an important guiding role in the industrial application of PS film laser cutting.

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Numerical analysis of laser ablation and damage in glass with multiple picosecond laser pulses

Cited by 67 publications

References 22 publications

Mechanisms of damage formation in glass in the process of femtosecond laser drilling

Mechanisms of damage formation in glass in the process of femtosecond laser drilling

Micro Drilling Simulation of Ultra-Short Pulsed Laser Ablation of Glass

Composition conversion and parameters influence of nanosecond ultraviolet laser cutting polystyrene film

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