The workpiece descent type multi-wire saw uses a slicer to dice silicon wafers. This slicing method uses a cutting fluid mixed with abrasive grains, which is called as slurry. The slurry is applied on the wire tool to be carried into the processing area. Therefore, the adhesion conditions and the action of the slurry affect the slicing characteristics. In this project, the relation between the slurry action and the slicing characteristics was studied. The processing mechanism of a multi-wire saw with a descending workpiece was investigated.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.