Five-layered Al/Al-Cu functionally graded material (FGM) was fabricated by powder metallurgy technology. The microstructure and composition of the prepared specimen were studied. Vickers hardness, flexural strength and fracture surface morphology were also measured. The results showed that Al/Al-Cu graded material with dense structure and compositional continuous change was obtained by solution-precipitation method. The graded materials presented a compositional continuous change along the graded direction because of the diffusion effect, and the Vickers hardness was liner proportional to the distribution of Cu content. Compared with pure sintered Al, remarkable improvement on hardness and fracture strength was achieved due to the CuAl2 phase dispersively distributed in the matrix. With the increase of Cu content, the fracture mode changed from tough fracture to the tendency of brittle fracture.
Electron beam melting is an effective method to remove volatile impurities in silicon, during which impurities such as P, Al and Ca etc. can be removed to less than 0.3×10-4wt.%. However, so far there is few research on the influence of electron beam parameters, such as beam density and beam size, on molten pool morphology, hence electron beam melting process has not been completely understood, which leads to low energy utilization. In this paper, on the basis of beam size calibration, the influence of beam density and beam size on molten pool morphology is investigated and the concept of melting angle is proposed to characterize molten pool morphology. At the same time, the optimal molten pool morphology for impurities removal and the corresponding electron beam parameters are also analyzed.
Multi-crystalline silicon ingots were prepared by directional solidification using vacuum induction melting furnace. The content of aluminum and iron deeply decreased in the columnar crystal region of the multi-crystalline silicon ingots. The columnar crystal growth broke off corresponded to the iron contents sharply increased. The height of columnar crystal in the silicon ingots related to the pulling rates had been clarified by the constitutional supercooling theory. The maximum of the resistivity and the minority carrier lifetime closed to the transition zone where the conductive type changed from p-type to n-type in silicon ingots. Further analysis suggested that the electrical properties were related to the contents of shallow level impurities aluminum, boron and phosphorus.
The distribution of resistivity, impurity and polarity in multicrystalline silicon ingot prepared by directional solidification method was detected. The effect of impurity distribution on resistivity was also researched. The results show that the shapes of equivalence line of resistivity in the cross section and vertical section of the silicon ingot depend on the solid-liquid interface. The resistivity in the vertical section increases with the increasing of solidified height at the beginning of solidification and reaches to maximum at the polarity transition point, then decreases rapidly with the increasing of solidified height and tends to zero on the top of the ingot because of the high impurity concentration. Study proves that the variation of resistivity in the vertical section is mainly relevant to the concentration distribution of the impurities such as Al, B and P in the growth direction.
Electron beam injection(EBI) is a process of gathering the electrons in materials using electron beam(EB). The EBI technology is proposed for purification of silicon particles by removing metal impurities through high-temperature oxidation, EBI, and HF acid washing processes. Analysis of silicon particle morphology after high-temperature oxidation using digital camera and after EBI using scanning electron microscope(SEM) were conducted. Then, the composition of silicon particles was analyzed using inductively coupled plasma(ICP). The silicon particle colours turned bright after EBI; therefore, EBI can change the thickness of SiO2 films in addition to increasing the temperature of the silicon particles. The results show that this technology is effective in removing metal impurities in silicon particles.
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