This paper aims to propose a novel placing method, i.e., place-between-paste-andpad (PB), for mini-scale passive components to enhance electronic assembly lines' yield. PB means a component is designed to be placed at the midpoint between the pastes and pads on the length direction while it aligns with the pads' center on the width direction. An experiment that involves 12 printed circuit boards (PCB) is designed and conducted to get comparative results. Four PCBs are employed for place-on-pad (PP), place-on-paste (PPS), and PB separately. On each board, 375 resistors R0402M (0.40 mm × 0.20 mm) are assembled horizontally.To study the components' misalignment under various solder paste offset conditions in different placement methods, a stencil with 25 solder paste offset settings is utilized. Based on this experiment's results, PB has superior performance to the other two methods to minimize components' misalignment. Regarding the number of acceptable components when post-reflow offsets are within 25% of components' dimensions, PB and PP have equivalent performances, and they both outperform PPS. Furthermore, PB is a lowcost placing strategy because PB needs not the real-time communication between the solder paste inspection machine and the pickand-place machine. With the miniaturization trend in electronic products, the postreflow components' misalignment is more frequently observed than before. The placement method proposed in this study is expected to offer a low-cost exploration in the component pick-and-place procedure to enhance the surface mount technology (SMT) assembly quality.Keywords SMT assembly • mini-scale passive components • pick-and-place • place-on-pad • place-on-paste beneficial for large components in decreasing 56 the misalignment [3]-[5], it did not perform so 57 well for mini-scale components.
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