The study of the epoxy-based anisotropic conductive adhesive in electronic packaging interconnects applications (chip-on-glass, chip-on-flex, etc. especially in RFID applications) has received particular attention. This is due to its potential advantages of finer pitch printing, reducing environmental contamination. The thermal curing process is critical to develop the ultimate electrical and mechanical properties of the ACA devices. In this article, the curing kinetics of ACA was studied with a differential scanning calorimeter (DSC) under constant heating rates conditions in the range of 520 °C/min. The model free method was used to describe the curing reaction. The degree-of-cure and the activation energy through the whole conversion range were mathematically determined and used to predict the progress of the curing process. Experimental results show that the activation energy of the ACA varies significantly with degree-of-cure during the curing process. The peculiar phenomenon indicates that the ACA underwent a complex series of reactions. The kinetics of curing reaction changes when large conversion values are reached at low heating rates. The change in the reaction kinetics is due to vitrification of the ACA during heating. In addition, the degree-of-cure of the ACA as a function of bonding times during isothermal ACA bonding process was theoretically predicted.
RFID is recognized one of the most potential information technologies. The RFID tag is a small tag containing an integrated circuit chip and an antenna. Voids can very often be detected in the non-metalized area of the RFID tags, they generated with unpredictable size and located randomly in the tag. The formation of the voids is the combined action of material properties and bonding parameters. In this work, the formation of the material related voids in the tags was investigated by thermogravimetric analysis. All specimens showed continuous loss of mass to varying degrees during the heating process. The air and moisture entrapped in the polymer matrix in the fabrication process and the process of use are the mainly reason. The loss mass of the etched antenna substrate primarily came from the lamination adhesive has not cured completely. With the simultaneous reaction of thermal stresses and internal vapor/volatile gas pressure drives both pre-existing and newly nucleated voids to grow. In addition, the voids growth under the high temperature (85°C) and high humidity (85%RH) conditions was investigated. The characteristic size of voids increases gradually with the increasing aging time because of the combined effects of the residual stress and the different coefficients of thermal expansion and moisture expansion.
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