Development of micromachines and MEMS (microelectromechanical system) devices are making steady progress at present. The size of components used in these micromachines and MEMS devices is expected to be in the order of p m, and the mechanical properties of such materials may be different from those of bulk materials. Therefore, the evaluation of mechanical properties such as Young's modulus, tensile strength and fatigue properties is essential for the design of micromachines and MEMS devices. Young's modulus, fracture stress and hardness of thin films and small elements of silicon single crystals have been measured [la]. In addition to modulus and strength of such mimsized
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