Remarkable progress has been made in electronic systems while reducing cost and power while simultaneously increasing the reliability by attaching unpackaged ICs directly to a high density-wired substrate. This multichip technology .offers significant advantages like reduction in interchip wiring length and associated loading effects[l]. Multichip modules are gaining importance gradually for high-speed applications in satellite communications, LAN and radio paging networks[2]. The dense interconnection system and the multilayer nature of the MCM structure introduces limitations on system-performance at high-speed operations, since the nearby conductors develop electromagnetic coupling and develop a voltage called cross-talk voltage. This voltage has to be controlled for better and proper functioning of the circuit ahead. This has motivated this work to develop practical MCM structures which will result in minimum cross-talk voltages in the nearby interconnects. In this paper, diflerent cross-talk minimisation techniques are presented with a few numerical examples. The proposed negative shielding concept for multilayered structures is also presented in this paper.
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