Thick cubic and sp2-bonded boron nitride (cBN and sp2BN) films are deposited on Ti substrates by plasma jet enhanced chemical vapor deposition using the chemistry of fluorine, and their direct current-voltage characteristics are studied for Ni-BN-Ti capacitor structures. The resistivity of the cBN film measured at room temperature is of the order of 108 Ωcm, which is three to four orders of magnitude lower than that of the sp2BN film. At high electric fields, Frenkel-Poole emission dominates the conduction of the sp2BN film, while thermionic emission is better able to describe the conduction of the cBN film at temperatures up to 473 K. A lower leakage current indicates lower densities of carriers and trap sites associated with defects, suggesting that a higher-quality cBN film with higher crystallinity and stoichiometry is potentially promising as an ultrahard dielectric material in high temperature condition.
Metal-insulator-metal capacitor structures using thick hexagonal and cubic boron nitride (hBN and cBN) films as dielectrics are produced by plasma jet-enhanced chemical vapor deposition, and their electrical transport and capacitance characteristics are studied in a temperature range of 298 to 473 K. The resistivity of the cBN film is of the order of 107 Ω cm at 298 K, which is lower than that of the hBN film by two orders of magnitude, while it becomes the same order as the hBN film above ∼423 K. The dominant current transport mechanism at high fields (≥1 × 104 V cm−1) is described by the Frenkel-Poole emission and thermionic emission models for the hBN and cBN films, respectively. The capacitance of the hBN film remains stable for a change in alternating-current frequency and temperature, while that of the cBN film has variations of at most 18%. The dissipation factor as a measure of energy loss is satisfactorily low (≤5%) for both films. The origin of leakage current and capacitance variation is attributed to a high defect density in the film and a transition interlayer between the substrate and the film, respectively. This suggests that cBN films with higher crystallinity, stoichiometry, and phase purity are potentially applicable for dielectrics like hBN films.
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