Fiber Bragg grating (FBG) is an optical fiber sensor and is suitable for acoustic emission (AE) measurements of structures such as chemical plants that require water resistance, explosion proofing, and so forth, However, directionality has been a problem in conventional usage which glues the grating range of an FBG to the inspection surface. This study proposes a cylinder-FBG (C-FBG) sensor with the FBG glued to a cylindrical sensor holder. Effectiveness of the sensor was evaluated by characterizing directionality and frequency sensitivity of the sensor and by comparing the detected AE signals in a 3-point bending test of a carbon fiber reinforced plastic (CFRP) laminate against a conventional wide-band piezoelectric AE sensor. The features of the detected signals were similar to the signals detected by the wide-band AE sensor. These results show that it is possible to produce a wide-band cylindrical sensor without the directionality limitations of the conventional usage of FBG.
It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead -free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were performed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of conventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.
Solderability of conventional Sn-37Pb solder pastes and Pb-free alloys (Sn-43Bi and Sn-2Ag-5Bi-O.5Cu) were examined on micro soldering using a YAG laser. Experiments were performed in order to determine the range of soldering parameters of a laser power density and an irradiation time for obtaining an appropriate wettability based on a visual inspection by a Japanese Industrial Standard. And the laser soldering processes were monitored by measuring temperature change inside solder joint (solder and Cu pad) and on a surface of a chip component. Next joining strength of chip components for surface mounting soldered on printed circuit board (glass epoxy) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics at different power density and materials were examined around thermal shock test by the gas phase method. As a result, characteristics of Sn-Ag-Bi-Cu (Pb-free) solder paste are equivalent to that of Sn-Pb solder paste.
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