In a system of thin alternating layers of superconductors and insulators the equations describing static and dynamic fluxon solutions are derived. The approach, represented by a useful compact matrix form, is intended to describe systems fabricated for example of niobium or niobium-nitride thin films; in the limit of ultrathin superconductor films it may give a model for describing fluxon motion in layered high-T, superconductors. Numerical examples of current versus voltage curves to be expected in such an experiment are presented.

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Thin films of multiferroic (Bi0.6Tb0.3La0.1)FeO3 were grown on Pt∕Ti∕SiO2∕Si substrate under various oxygen pressures by pulsed laser deposition technique. X-ray diffraction patterns show that the crystallinity of the thin film is improved with decreasing depositing oxygen pressure and the thin film grown at a lower oxygen pressure of 0.01torr exhibits a single perovskite phase with preferred (001) orientation. Leakage current of the as-deposited thin films decreases with decreasing grown oxygen pressure. Significantly, the leakage current of the thin films can be reduced largely by an annealing process at 800°C with flowing oxygen. The annealed thin films show a relatively high resistivity and stable polarization loops with double remnant polarization of about 3μC∕cm2. The conduction properties of the thin films have been well analyzed, and it is indicated that the dominant conduction mechanism is the space-charge-limited conduction for the thin film grown at higher oxygen pressure and the Poole-Frenkel conduction for the thin films grown at lower oxygen pressure.

Self-aligned-gate Pt/SrBi2Ta2O9/HfAlO/Si metal/ferroelectric/insulator/semiconductor (MFIS) field-effect transistors (FETs) were fabricated. Drain current (I d) versus gate voltage curves of the MFIS FETs showed almost the same steepness as that of a non-self-aligned-gate Pt/HfAlO/Si metal/insulator/semiconductor FET. Long retention times with large on- and off-state I d ratios were obtained for the MFIS FETs. The retention times more than 33 days with an on- and off-state I d ratio over 105 were demonstrated for the self-aligned-gate MFIS FET with a 2-µm-long and 80-µm-wide gate. This device showed the longest memory retention among all of the ferroelectric-gate FETs reported ever before.