The densification of integrated circuits requires thermal management strategies and high thermal conductivity materials1–3. Recent innovations include the development of materials with thermal conduction anisotropy, which can remove hotspots along the fast-axis direction and provide thermal insulation along the slow axis4,5. However, most artificially engineered thermal conductors have anisotropy ratios much smaller than those seen in naturally anisotropic materials. Here we report extremely anisotropic thermal conductors based on large-area van der Waals thin films with random interlayer rotations, which produce a room-temperature thermal anisotropy ratio close to 900 in MoS2, one of the highest ever reported. This is enabled by the interlayer rotations that impede the through-plane thermal transport, while the long-range intralayer crystallinity maintains high in-plane thermal conductivity. We measure ultralow thermal conductivities in the through-plane direction for MoS2 (57 ± 3 mW m−1 K−1) and WS2 (41 ± 3 mW m−1 K−1) films, and we quantitatively explain these values using molecular dynamics simulations that reveal one-dimensional glass-like thermal transport. Conversely, the in-plane thermal conductivity in these MoS2 films is close to the single-crystal value. Covering nanofabricated gold electrodes with our anisotropic films prevents overheating of the electrodes and blocks heat from reaching the device surface. Our work establishes interlayer rotation in crystalline layered materials as a new degree of freedom for engineering-directed heat transport in solid-state systems.

Quantum computing based on superconducting qubits requires the understanding and control of the materials, device architecture, and operation. However, the materials for the central circuit element, the Josephson junction, have mostly been focused on using the AlO x tunnel barrier. Here, we demonstrate Josephson junctions and superconducting qubits employing two-dimensional materials as the tunnel barrier. We batch-fabricate and design the critical Josephson current of these devices via layer-by-layer stacking N layers of MoS2 on the large scale. Based on such junctions, MoS2 transmon qubits are engineered and characterized in a bulk superconducting microwave resonator for the first time. Our work allows Josephson junctions to access the diverse material properties of two-dimensional materials that include a wide range of electrical and magnetic properties, which can be used to study the effects of different material properties in superconducting qubits and to engineer novel quantum circuit elements in the future.

To design and optimize for capabilities of additive manufacturing processes it is also necessary to understand and model their variations in geometric and mechanical properties. In this paper, such variations of inkjet 3D printed parts are systematically investigated by analyzing parameters of the whole process, i.e. storage of the material, printing, testing, and storage of finished parts. The goal is to both understand the process and determine the parameters that lead to the best mechanical properties and the most accurate geometric properties. Using models based on this understanding, we can design and optimize parts, and fabricate and test them successfully, thus closing the loop. Since AM materials change rapidly and this process will have to be repeated, it is shown how to create a cost and time efficient experimental design with the one-factor-at-a-time and design of experiments methods, yielding high statistical accuracies for both main and interaction effects. The results show that the number of intersections between layers and nozzles along the load-direction has the strongest impact on the mechanical properties followed by the UV exposure time, which is investigated by part spacing, the position on the printing table and the expiry date of the material. Minor effects are found for the storage time and the surface roughness is not affected by any factor. Nozzle

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Weak bonding between the distorted layer of Bi 4 O 4 SeCl 2 helps limit its heat transport