Edge-enriched transition metal dichalcogenides, such as WS 2 , are promising electrocatalysts for sustainable production of H 2 through the electrochemical hydrogen evolution reaction (HER). The reliable and controlled growth of such edge-enriched electrocatalysts at low temperatures has, however, remained elusive. In this work, we demonstrate how plasma-enhanced atomic layer deposition (PEALD) can be used as a new approach to nanoengineer and enhance the HER performance of WS 2 by maximizing the density of reactive edge sites at a low temperature of 300 °C. By altering the plasma gas composition from H 2 S to H 2 + H 2 S during PEALD, we could precisely control the morphology and composition and, consequently, the edge-site density as well as chemistry in our WS 2 films. The precise control over edge-site density was verified by evaluating the number of exposed edge sites using electrochemical copper underpotential depositions. Subsequently, we demonstrate the HER performance of the edge-enriched WS 2 electrocatalyst, and a clear correlation among plasma conditions, edge-site density, and the HER performance is obtained. Additionally, using density functional theory calculations we provide insights and explain how the addition of H 2 to the H 2 S plasma impacts the PEALD growth behavior and, consequently, the material properties, when compared to only H 2 S plasma.

With downscaling of device dimensions, two-dimensional (2D) semiconducting transition metal dichalcogenides (TMDs) such as WS2 are being considered as promising materials for future applications in nanoelectronics. However, at these nanoscale regimes, incorporating TMD layers in the device architecture with precise control of critical features is challenging using current top-down processing techniques. In this contribution, we pioneer the combination of two key avenues in atomic-scale processing: area-selective atomic layer deposition (AS-ALD) and growth of 2D materials, and demonstrate bottom-up processing of 2D WS2 nanolayers. Area-selective deposition of WS2 nanolayers is enabled using an ABC-type plasma-enhanced ALD process involving acetylacetone (Hacac) as inhibitor (A), bis­(tert-butylimido)-bis­(dimethylamido)-tungsten as precursor (B), and H2S plasma as the co-reactant (C) at a low deposition temperature of 250 °C. The developed AS-ALD process results in the immediate growth of WS2 on SiO2 while effectively blocking growth on Al2O3 as confirmed by in situ spectroscopic ellipsometry and ex situ X-ray photoelectron spectroscopy measurements. As a proof of concept, the AS-ALD process is demonstrated on patterned Al2O3/SiO2 surfaces. The AS-ALD WS2 films exhibited sharp Raman (E 2g 1 and A 1g) peaks on SiO2, a fingerprint of crystalline WS2 layers, upon annealing at temperatures within the thermal budget of semiconductor back-end-of-line processing (≤450 °C). Our AS-ALD process also allows selective growth on various TMDs and transition metal oxides while blocking growth on HfO2 and TiO2. It is expected that this work will lay the foundation for area-selective ALD of other 2D materials.

2020). Large area, patterned growth of 2D MoS2 and lateral MoS2-WS2 heterostructures for nano-and opto-electronic applications. Nanotechnology, 31(25), [255603]. https://doi. AbstractThe patterned growth of transition metal dichalcogenides (TMDs) and their lateral heterostructures is paramount for the fabrication of application-oriented electronics and optoelectronics devices. However, the large scale patterned growth of TMDs remains challenging. Here, we demonstrate the synthesis of patterned polycrystalline 2D MoS 2 thin films on device ready SiO 2 /Si substrates, eliminating any etching and transfer steps using a combination of plasma enhanced atomic layer deposition (PEALD) and thermal sulfurization. As an inherent advantage of ALD, precise thickness control ranging from a monolayer to fewlayered MoS 2 has been achieved. Furthermore, uniform films with exceptional conformality over 3D structures are obtained. Finally, the approach has been leveraged to obtain in-plane lateral heterostructures of 2D MoS 2 and WS 2 thin films over a large area which opens up an avenue for their direct integration in future nano-and opto-electronic device applications.Supplementary material for this article is available online

We evaluate the impact of defects in WO3 thin films on the photoelectrochemical (PEC) properties during water splitting. We study physical defects, such as micro holes or cracks, by two different deposition techniques: sputtering and atomic layer deposition (ALD). Chemical defects, such as oxygen vacancies, are tailored by different annealing atmospheres, i.e. air, N2, and O2. The results show that the physical defects inside the film increase the resistance for the charge transfer and also result in a higher recombination rate which inhibits the photocurrent generation. Chemical defects yield in an increased adsorption of OH groups on the film surface and enhance the PEC efficiency. Excess amount of chemical defects can also inhibit the electron transfer, thus decreasing the photocurrent generation. In this study, the highest performance was obtained for WO3 films deposited by ALD and annealed in air, which have the least physical defects and an appropriate amount of oxygen vacancies.

Two-dimensional (2D) layered transition metal dichalcogenides (TMDs) such as WS2 are promising materials for nanoelectronic applications. However, growth of the desired horizontal basal-plane oriented 2D TMD layers is often accompanied by the growth of vertical nanostructures that can hinder charge transport and, consequently, hamper device application. In this work, we discuss both the formation and suppression of vertical nanostructures during plasma-enhanced atomic layer deposition (PEALD) of WS2. Using scanning transmission electron microscopy studies, formation pathways of vertical nanostructures are established for a two-step (AB-type) PEALD process. Grain boundaries are identified as the principal formation centers of vertical nanostructures. Based on the obtained insights, we introduce an approach to suppress the growth of vertical nanostructures, wherein an additional step (C)a chemically inert Ar plasma or a reactive H2 plasmais added to the original two-step (AB-type) PEALD process. This approach reduces the vertical nanostructure density by 80%. It was confirmed that suppression of vertical nanostructures goes hand in hand with grain size enhancement. The vertical nanostructure density reduction consequently lowers film resistivity by an order of magnitude. Insights obtained in this work can contribute toward devising additional pathways, besides plasma treatments, for suppressing the growth of vertical nanostructures and improving the material properties of 2D TMDs that are relevant for nanoelectronic device applications.