In this paper, we investigated an anomalous hump in the bottom gate staggered amorphous indium-gallium zinc oxide thin-film transistors. During the positive gate bias stress, a positive threshold voltage shift is observed in transfer curve and an anomalous hump occurs as the stress time increases. The hump becomes more serious as the gate bias stress increases while it is not observed under the negative bias stress. From the simulation of a long range migration of zinc interstitial ions (Zni) and the measurement of the diode characteristics after the constant positive bias stress, the origin of the hump can be explained by the migration of the positively charged mobile Zni during the constant positive gate bias stress, which can be conformed by increasing the concentration of Zni from the result of the Auger ZnL3M4.5M4.5 spectra.
In this paper, we investigated the anomalous hump in the bottom gate staggered a-IGZO TFTs. During the positive bias stress, a positive threshold voltage shift was observed in the transfer curve and an anomalous hump occurred as the stress time increased. The hump became more serious in higher gate bias stress while it was not observed under the negative bias stress. The analysis of constant gate bias stress indicated that the anomalous hump was influenced by the migration of positively charged mobile interstitial zinc ion towards the top side of the a-IGZO channel layer.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.