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A simple direct solution coating process for forming CuInSe₂ (CIS) thin films was described, employing a low-cost and environmentally friendly precursor solution. The precursor solution was prepared by mixing metal acetates, ethanol, and ethanolamine. The facile formation of a precursor solution without the need to prefabricate nanoparticles enables a rapid and easy processing, and the high stability of the solution in air further ensures the precursor preparation and the film deposition in ambient conditions without a glove box. The thin film solar cell fabricated with the absorber film prepared by this route showed an initial conversion efficiency of as high as 7.72 %.

CuInSe2 (CISe) absorber layers for thin-film solar cells were fabricated through the selenization of amorphous Cu-In-S nanoparticles, which were prepared by using a low-temperature colloidal process within one minute without any external heating. Two strategies for obtaining highly dense CISe absorber films were used in this work; the first was the modification of nanoparticle surface through chelate complexation with ethanolamine, and the second strategy utilized the lattice expansion that occurred when S atoms in the precursor particles were replaced with Se during selenization. The synergy of these two strategies allowed formation of highly dense CISe thin films, and devices fabricated using the absorber layer demonstrated efficiencies of up to 7.94% under AM 1.5G illumination without an anti-reflection coating.

CuInSe 2 (CIS) absorber layers for thin film solar cells were fabricated via a non-vacuum route using amorphous Cu-In-Se nanoparticle precursors prepared by a low temperature colloidal process within one minute of reaction without any external heating. In particular, we intentionally added a chelating agent to the nanoparticle colloid in order to increase the density of the final films by enhancing the viscous flow of precursor materials during high temperature selenization. This is based on the decreased reactivity of precursor particles due to the formation of chelate complexes at particle surfaces. While the CIS films formed from the amorphous Cu-In-Se particles without surface modification were found to have large voids, those formed from surface modified particles showed flat and dense morphologies. In accordance with the improvements in the film morphology and density, efficiencies of the devices were also significantly increased from 0% (complete short circuit in the case without surface modification) to 4.41% (with surface modification).

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