A small irrigation pond for a rice paddy field is a very important refuge for aquatic insects and plants. To reveal environmental factors determining species composition of aquatic insect and plant communities, we analyzed water chemistry and connection between pond and surrounding in five types of irrigation ponds based on water source and connection in CCZ of South Korea: stagnation, exchange-stagnation, spring, stagnation-spring, and exchangespring types. The stagnation type had the most stable water chemistry among the 16 irrigation ponds studied, and the spring type had the most variable water chemistry. Anion content was highest in the stagnation type, and cation content was highest in the exchange-stagnation type. 228 taxa including 63 wetland plants and 95 aquatic insect taxa were recorded. Six rare plant species and four rare aquatic insect species were identified. The stagnation-spring type had the highest species richness. There was no correlation between size and species richness. Multivariate analyses showed distinctive species assemblages among the irrigation pond types. This would indicate that water chemical change at annual cycle and connection influenced on the species assemblages in irrigation pond. In additional, irrigation pond contributes to regional biodiversity in agricultural areas, as irrigation pond provides heterogeneous communities for the freshwater ecosystem.

New low temperature, low cost, small size packaging technology of novel bulk-micromachined MEMS sensor for mobile applications was developed. The sensor was fabricated with the bulk-micromachining process of SOI substrates and composed with a proof mass, membrane and electrodes for capacitance sensing. The sensor device was capped with very thin (130um-thickness) top and bottom silicon cap wafers which have a 80um-depth cavity. Top and bottom cap wafers were bonded with the sensor wafer with a low temperature curing polymer adhesive lower than 200°C. It is needed that the low temperature packaging technology and the passivation of top and bottom sides of the sensor for keeping the sensor performances and preventing stiction of the proof-mass during the molding processes. After bonding the three substrates, the top cap silicon was dry etched to expose bonding pads for the signal interconnection. The ASIC chip was polished to 75um-thickness, diced and bonded on a half-etched 200um-thick lead-frame with a DAF. The diced wafer-level-capped sensor was stacked on the ASIC, wire bonding was accomplished between the sensor and the ASIC, and the ASIC and the lead-frame and finally transfer molding process was done. The developed package is 24-leads QFN and the dimension is 4.0mm×4.0mm×1.1/1.2mm.