In this work, we investigate by means of simulations the performance of basic digital, analog, and mixed-signal circuits employing tunnel-FETs (TFETs). The analysis reviews and complements our previous papers on these topics. By considering the same devices for all the analysis, we are able to draw consistent conclusions for a wide variety of circuits. A virtual complementary TFET technology consisting of III-V heterojunction nanowires is considered. Technology Computer Aided Design (TCAD) models are calibrated against the results of advanced full-quantum simulation tools and then used to generate look-up-tables suited for circuit simulations. The virtual complementary TFET technology is benchmarked against predictive technology models (PTM) of complementary silicon FinFETs for the 10 nm node over a wide range of supply voltages (VDD) in the sub-threshold voltage domain considering the same footprint between the vertical TFETs and the lateral finFETs and the same static power. In spite of the asymmetry between p-and n-type transistors, the results show clear advantages of TFET technology over FinFET for VDD lower than 0.4V. Moreover, we highlight how differences in the I-V characteristics of FinFETs and TFETs suggest to adapt the circuit topologies used to implement basic digital and analog blocks with respect to the most common CMOS solutions.

This brief presents an energy-efficient level shifter (LS) able to convert extremely low level input voltages to the nominal voltage domain. To obtain low static power consumption, the proposed architecture is based on the single-stage differential-cascode-voltage-switch scheme. Moreover, it exploits self-adapting pull-up networks to increase the switching speed and to reduce the dynamic energy consumption, while a split input inverting buffer is used as the output stage to further improve energy efficiency. When implemented in a commercial 180-nm CMOS process, the proposed design can up-convert from the deep subthreshold regime (sub-100 mV) to the nominal supply voltage (1.8 V). For the target voltage level conversion from 0.4 to 1.8 V, our LS exhibits an average propagation delay of 31.7 ns, an average static power of less than 60 pW, and an energy per transition of 173 fJ, as experimentally measured across the test chips

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In this paper, we identify the level shifter (LS) for voltage up-conversion from the ultralow-voltage regime as a key application domain of tunnel FETs (TFETs).We propose a mixed TFET–MOSFET LS design methodology, which exploits the complementary characteristics of TFET and MOSFET devices.\ud Simulation results show that the hybrid LS exhibits superior dynamic performance at the same static power consumption compared with the conventional MOSFET and pure TFET solutions. The advantage of the mixed design with respect to the conventional MOSFET approach is emphasized when lower voltage signals have to be up-converted, reaching an improvement of the energy-delay product up to three decades. When compared with the full MOSFET design, the mixed TFET–MOSFET solution appears to be less sensitive toward threshold voltage variations in terms of dynamic figures of merit, at the expense of higher leakage variability. Similar results are obtained for four different LS topologies, thus indicating that the hybrid TFET–MOSFET approach offers intrinsic advantages in the design of LS for voltage up-conversion from the ultralow-voltage regime compared with the conventional MOSFET and pure TFET solutions