Carbon nanotubes are fabricated using chemical vapor deposition at predetermined locations by patterning catalyst directly on a substrate with nanometer‐scale precision using dip‐pen nanolithography with multipen cantilevers (see image). The development of new molecular inks for the deposition of the precursor catalyst results in a high yield of isolated carbon nanotubes, ideal for subsequent device fabrication.
The cover picture shows a process used to fabricate carbon nanotubes (CNTs) by chemical vapor deposition (CVD). This process is enabled by patterning catalyst ink directly on silicon substrates with nanometer‐scale precision using dip‐pen nanolithography. A multipen writing method is employed to increase the patterning rate. The development of new molecular inks for the deposition of the precursor catalyst results in a high yield of isolated CNTs, ideal for subsequent device fabrication. The work demonstrates advantages of the new method for producing high‐quality isolated CNTs in scalable array geometries. The image is a graphical representation of the patterning process. Arrays of dots are written with catalyst ink on the substrate at predefined locations marked by fiducial markers, which are alphabetical pairs of letters. After patterning, the CVD process facilitates synthesis of CNTs at the catalyst sites on the substrate. The arrows denote the final result‐isolated CNTs grown from nanocatalyst clusters. For more information, please read the Communication “Controllable Patterning and CVD Growth of Isolated Carbon Nanotubes with Direct Parallel Writing of Catalyst Using Dip‐Pen Nanolithography” by I. Kuljanishvili, V. Chandrasekhar, et al., beginning .
Monitoring of the intrinsic temperature and the thermal management is discussed for the carbon nanotube nano-circuits. The experimental results concerning fabricating and testing of a thermometer able to monitor the intrinsic temperature on nanoscale are reported. We also suggest a model which describes a bi-metal multilayer system able to filter the heat flow, based on separating the electron and phonon components one from another. The bi-metal multilayer structure minimizes the phonon component of the heat flow, while retaining the electronic part. The method allows one to improve the overall performance of the electronic nano-circuits due to minimizing the energy dissipation.
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