A multilayer ceramic capacitor (MLCC) vibrates when an electrical signal containing an alternating current (AC) component is applied to it. The piezoelectric and electrostrictive coefficients of the dielectric layer are needed to analyze such vibrations because both affect the vibration. Also, they must be determined for various direct current (DC) biases because an MLCC is operated with various electrical signals and the coefficients vary as the DC bias changes. We determined the coefficients by measuring the vibration of an MLCC under a range of DC biases. When a single‐frequency AC voltage is applied to an MLCC, it vibrates with both fundamental and second‐harmonic frequencies because of piezoelectricity and electrostriction. These frequencies were measured and separated into their piezoelectric and electrostrictive components to derive the piezoelectric and electrostrictive coefficients. Because of the difficulty of calculating the coefficients, a finite element (FE) method was adopted in consideration of the complicated structure of the MLCC. The derived piezoelectric coefficients were cross‐checked and verified by impact testing. The electrostrictive vibration component was greater than the piezoelectric one except when the applied DC electric field was near zero. This showed that both piezoelectricity and electrostriction must be considered in vibrational analyses of MLCCs.
Owing to the excellent electrical characteristics, multilayer ceramic capacitors (MLCCs) are widely used in a variety of electronic devices nowadays. The accompanying acoustic noise of MLCC related to its vibration is one of the most important factors when selecting MLCCs for specific applications. To evaluate the noise more efficiently, this study investigates a method to build simplified finite element models of MLCC. In addition, vibration analysis has been performed with the simplified model to discuss how structural parameters influence the vibration of MLCC. According to the findings in the study, suggestions and optimized solder design are given to lower the vibration of MLCC. In short, the main aim of this study is to present a new soldering method for MLCC vibration and noise reduction.
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