The outrigger and belt truss system is commonly used as one of the structural systems to effectively control the excessive drift due to lateral load and minimize the risk of structural and non-structural damage. However, this prominent structural system has a demerit of excessive stressing to structural and nonstructural members during construction due to differential column shortening. In this paper, several potential construction methods managing the outrigger to perimeter column joints experiencing differential column shortening are discussed. These methods include fixed joint without any adjustment, delayed joint, delayed joint with shim plate adjustment, and outrigger damper (or lock-up-device) installed joint. Based on our research through computer analysis, large scale laboratory test, shake table test and real installation of the apparatus to a high-rise project, the building with outrigger damper or lock-up-device system has many advantages in terms of building performance, construction convenience, quality control and cost reduction.
We propose a novel technique for mitigating the optical-beat-induced multi-user-interference (MUI) between the upstream multiple access signals in an orthogonal frequency division multiple access (OFDMA) passive optical network (PON). To provide upstream multiple access on a single-wavelength orthogonal frequency division multiplexing optical access network, optical beating interference and polarization diverseness are critical issues that severely degrade system performance. By using the proposed total intensity aggregation with self-homodyne coherent detection, we experimentally demonstrated stable transmission performance by reducing MUI in OFDMA PON upstream multiple access transmission.Index Terms-Multi user interference, multiple access, OFDMA PON, optical fiber communication, passive optical network.
Wafer-level packaged light-emitting diodes (LEDs) are useful for the high-power applications such as back light unit and general solid-state lighting due to the compactness and integrated fabrication process. In this letter, wafer-level packaged LEDs with red, green, and blue multichips were fabricated, and the thermal characteristics of wafer-level packaged LEDs with multichips such as thermal resistance and junction temperature are investigated using both serial and matrix measurement methods.
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