Thermal performance enhancement in microchannel heat sinks has recently become a challenge due to advancements in modern microelectronics, which demand compatibility with heat sinks able to dissipate ever-increasing amounts of heat. Recent advancements in manufacturing techniques, such as additive manufacturing, have made the modification of the microchannel heat sink geometry possible well beyond the conventional rectangular model to improve the cooling capacity of these devices. One such modification in microchannel geometry includes the introduction of secondary flow channels in the walls between adjacent mainstream microchannels. The present study computationally models secondary flow channels in regular trapezoidal and parallel orientations for fluid circulation through the microchannel walls in a heat sink design. The heat sink is made of silicon wafer, and water is used as the circulating fluid in this study. Continuity, momentum, and energy equations are solved for the fluid flow through the regular trapezoidal secondary flow and parallel secondary flow designs in the heat sink with I-type, C-type, and Z-type inlet–outlet configurations. Plots of velocity contours show that I-type geometry creates optimal flow disruption in the heat sink. Therefore, for this design, the pressure drop and base plate temperatures are plotted for a volumetric flow rate range, and corresponding contour plots are obtained. The results are compared with corresponding trends for the conventional rectangular microchannel design, and associated trends are explained. The study suggests that the flow phenomena such as flow impingement onto the microchannel walls and formation of vortices inside the secondary flow passages coupled with an increase in heat transfer area due to secondary flow passages may significantly improve the heat sink performance.
Computational study was conducted to investigate the thermal performance of water-based salt hydrate S44 nanoparticles as the phase change material (PCM) in a microchannel heat sink. Constant heat dissipation was applied on the top wall of the heat sink. Forced internal convection of the PCM slurry flow was performed through a homogeneous approach. Three thermal performance parameters, including effectiveness ratio, performance index, and Merit number, were used to quantify the cooling performance of S44 for various concentrations of the PCM nanoparticles. The thermal performance of the salt hydrate S44 slurry was also compared with a similar study conducted for lauric acid nanoparticle slurry found in the literature. Specific operating conditions were identified. The salt hydrate S44 would provide better thermal performance than lauric acid, and vice versa. Finally, Nusselt number correlations have been developed for the microchannel PCM heat sink for Reynolds numbers in the range 12.23 to 47.14 and Prandtl numbers in the range 3.74 to 5.30. A design guideline for manufacturing PCM particles and microchannel heat sinks is provided. With this guideline, the heat absorption ability of the heat sink is maximized, and the pumping power and the losses related to the addition of the particles are minimized.
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