The initial stage of epitaxial electrocrystallization of gold from an additive‐free, alkaline, sulfite solution on polycrystalline copper and silver substrates was found to be three‐dimensional crystallite formation. The crystallites on the copper substrates were laterally considerably smaller than those on silver. This effect is attributed to the larger lattice mismatch between gold and copper. On silver, substrate coverage occurred earlier and was followed by the formation of smaller, secondary crystallites. The internal stress in the gold deposits on silver was initially very small and tensile due to the small lattice mismatch and the large crystallite size. The stress rose to a maximum during secondary crystallite formation. On copper substrates, the stress was initially compressive because of the negative lattice‐mismatch component and then changed to tensile when crystallite coalescence became predominant.
Analytical electron microscopy of copper electrodeposits obtained in the presence of a brightener reveals the presence of inclusions decorating grain boundary dislocations as well as being randomly dispersed in the matrix. The inclusions, which are believed to originate from the brightener, were found to be in two different size ranges with mean values of 3.5 and 15.2 nm. Their respective densities were
1.1×1018 normaland 2.7×1015 cm−3
. The inclusions exhibited a polyhedral shape and have been shown to interact with boundary dislocations. Energy dispersive spectroscopy has indicated that the inclusions were richer in Cl and S than the surrounding matrix.
Die Anfangsstadien der epitaktischen Elektrokristallisation von Au aus einer Additiv‐freien, alkalischen Sulfitlösung auf polykristallinen Cu‐ und Ag‐Substraten bestehen in dreidimensionaler Kristallitbildung.
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