This paper deals with the basic concepts of Signature Analysis and the application of statistical models for its implementation. It develops a scheme for computing sample sizes when the failures are random. It also introduces statistical models that comprehend correlations among failures that fail due to the same failure mechanism. The idea of correlation is important because semiconductor chips are processed in batches. Also any risk assessment model should comprehend correlations over time. The statistical models developed will provide the required sample sizes for the Failure Analysis lab to state "We are A% confident that B% of future parts will fail due to the same signature." The paper provides tables and graphs for the evaluation of such a risk assessment. The implementation of Signature Analysis will achieve the dual objective of improved customer satisfaction and reduced cycle time. This paper will also highlight it's applicability as well as the essential elements that need to be in place for it to be effective. Different examples have been illustrated of how the concept is being used by Failure Analysis Operations (FA) and Customer Quality and Reliability Engineering groups.
With the recent advances in instrumentation, automation and spectrometer design, the Electron Beam Tester is fast becoming a standard tool for design verification and failure analysis of Very Large Scale Integrated Circuit (VLSI) technology products. This paper presents a brief overview of the principles of operation and a discussion of the different testing modes.The application of voltage contrast to VLSI technology is illustrated with a few typical examples taken from failure analysis and design verification stages of memory and microprocessor products.Present limitations and future trends of Electron Beam Testing are discussed.
This paper deals with the basic concepts of signature analysis, and will attempt to demonstrate how its implementation would enable efficient utilization of failure analysis engineering resources to analyze field failures and avoid repetitive analyses. This would accomplish the dual objective of improved customer satisfaction and reduced cycle time.Signature analysis methodology can be used in Failure Analysis, Design, Product, and Customer Quality and Reliability engineering group applications. Starting with definitions, purpose, and various possible scenarios, a formal mathematical framework is developed for computing sample sizes and establishing confidence levels when the failures occur at random or occur in clusters.
The advent of Flip Chip and other complex package configurations and process technologies have made conventional failure analysis techniques inapplicable. This paper covers the ways in which conventional techniques have been modified to meet the FA challenges presented by these new devices – specifically, by forcing analysis to be done from the backside of the device. Modifications to the traditional FA process steps, including new sample preparation methods, changes in hardware, and alterations to physical failure analysis processes are described. To demonstrate the use of backside analytical approaches, some examples of applications and a case study are also included.
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