We have developed a new document management system that aimed at change management of mask layout correction procedure that consists of OPC (Optical Proximity Correction) processing and lithography manufacturability checks in SoC (System on Chip) high-mix and small-quantity production. By systematically managing the OPC rule and the lithography manufacturability check result, we have eliminated mask correction troubles due to OPC management misled operation and lithography manufacturability check omission, and reduce the time of trouble solution of mask data correction originating.
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