A high-quality HfO2 gate stack with equivalent oxide thickness (EOT) of 7.8 Å and a leakage current of Jg=0.5 mA/cm2 @ Vg=−1.0 V has been achieved by an in situ rapid thermal chemical vapor deposition process. It is found that both NH3-based interface layer and N2 postdeposition annealing are very effective in reducing EOT and leakage, and at the same time, improving film qualities. These HfO2 gate stacks show negligible frequency dependence, small hysteresis in capacitance–voltage (C–V) and weak temperature dependence of the leakage current. They also show negligible charge trapping at high voltage stress.
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