Abstract3-Glycidyloxypropyltriethoxysilane and 3-Mercaptosilane were used to prepare a composite together with aluminum oxide. The compound is a potential candidate for being used as inorganic encapsulation. FTIR results paired with head-space analysis revealed a hardening of the composite at above 130 °C and degradation of the sol–gel-network above 150 °C. The adhesion of these compounds was tested via shear tests. It showed, that the addition of 3-Mercaptopropyltriethoxysilane enhanced the adhesion on silver significantly. This is attributed to the covalent nature of the Ag-S bond, which is forming as compared to the solely dispersive forces, when 3-Mercaptopropyltriethxysilane is not used. By conducting the shear test under temperature activation energies for the breakages were calculated. These coincide well with the binding energy of Ag-S in case silver surfaces are examined. In the case of a copper surface, a mixture of covalent and dipole–dipole interactions are found, since the activation energy for breakage is smaller as the Cu-O bond energy.
This work presents a method for a reliable assembly and interconnection of MEMS for very high temperatures. A flip-chip concept for resistive micromechanical pressure sensors with a platinum thin film was developed and sensorassemblies were fabricated. The investigated metallized ceramic substrates were AlN, Si 3 N 4 , a Low-Temperature-Cofired-Ceramic (LTCC) and a zirconia-silicate (ZrSiO 4 ). A borosilicate glass-solder was the die-attachment material and gold stud-bumps were the interconnection. The thermalmechanical stresses in the sensors, induced by the packaging process due to material-dependent mismatches were analyzed with FEM and optical deformation measurements from 20 to 500 °C. The comparison of the obtained experimental and FE-results revealed a strong influence of the applied substrate on the thermal-mechanical stresses in the chip-membrane which is affecting the output-signal and reliability. Both methods were in good accordance. The two specific silicon-matched ceramic substrates LTCC and ZrSiO 4 reduced the stresses in the sensor-element significantly. Furthermore, the electrical characterization of assembled test-sensors revealed a correlation between the package-induced stresses in the chip-membrane and the shift of the sensor-signal after the assembly-process.
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