In this paper, an interconnect scheme based on automotion of domain walls for all-spin logic has been proposed. The proposed interconnect is analyzed using a comprehensive numerical model including an equivalent circuit for all-spin logic operations [1], the one-dimensional Landau-Lifshitz-Gilbert equation for domain wall creation, reflection, and disappearance at the boundaries. Analytical expressions for domain wall transport [2][3][4] along the wire are also presented. From the model, it is found that the reflection of the domain wall can be eliminated by using a material with high Gilbert damping coefficient at the end, the energy dissipation can be independent of the interconnect length, and domain wall displacement and energy dissipation can be further improved using a material with a low damping factor and saturation magnetization. Furthermore, the interconnect reliability is also studied by applying the thermal random noise analysis on the dynamics of domain walls, and it is found that thermal fluctuations can have a significant impact on the interconnect performance; thus, the interconnect with a low Gilbert damping factor is desired to suppress the thermal noise effects.
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