This paper reports an AlGaN-based narrow-band ultraviolet-B (NB-UVB) light-emitting diode (LED) exhibiting a single electroluminescence peak with a full-width at half-maximum (FWHM) of less than 10 nm at forward currents (I f ) from 10 to 200 mA, broadening to 11.6 nm when the forward current reached 350 mA. We attribute the narrow FWHM to effectively decreasing the degrees of piezoelectric polarization in the MQWs, and the excess electron overflow from the MQW to the p-layer was avoided. The maximum external quantum efficiency (EQE) of 2.16% and wall plug efficiency of 1.74% occurred when the forward current was 10 mA; the EQE dropped by 8.6% when the forward current increased from 10 to 60 mA. Furthermore, the light output power decreased to 85.4 and 82.5% of its initial value after 620 and 3500 h, respectively, under conditions of 60 mA dc aging. The characteristics of this NB-UVB LED suggest great potential for its application in phototherapy.
In this paper we report epoxy molding compound lead frames (EMC-LFs) with encapsulated silicone as a simple and inexpensive packaging for AlGaN-based ultraviolet-B (UVB) light-emitting diodes (LEDs) displaying high light extracting efficiencies (LEE) and long operation lifetimes. The convex surfaces and beveled shapes obtained after curing the encapsulated silicone surrounding the UVB-LED chips significantly enhanced the light output power (LOP). With silicone present inside the EMC-LFs having bonding cavity diameters of 1.7 and 1.45 mm, the LOPs of the UVB-LEDs improved by 26 and 42%, respectively; reliability tests performed over a period of 1000 h revealed, however, that the LOPs decreased to 70 and 71%, respectively, of their initial values, but no cracks appeared in the silicone during such longterm operation. Thus, the stability of silicone-encapsulating EMC-LFs for UVB-LEDs was acceptable. When compared with AlN-based direct plating copper ceramic lead frames (AlN-DPC-LFs), our proposed packaging structure and method have the potential to lower the manufacturing cost of UVB-LEDs.INDEX TERMS AlGaN, AlGaN-based ultraviolet-B LEDs, Packaging, Light output power.
In this study, we suppressed the parasitic emission caused by electron overflow found in typical ultraviolet B (UVB) and ultraviolet C (UVC) light-emitting diodes (LEDs). The modulation of the p-layer structure and aluminum composition as well as a trade-off in the structure to ensure strain compensation allowed us to increase the p-AlGaN doping efficiency and hole numbers in the p-neutral region. This approach led to greater matching of the electron and hole numbers in the UVB and UVC emission quantum wells. Our UVB LED (sample A) exhibited clear exciton emission, with its peak near 306 nm, and a band-to-band emission at 303 nm. The relative intensity of the exciton emission of sample A decreased as a result of the thermal energy effect of the temperature increase. Nevertheless, sample A displayed its exciton emission at temperatures of up to 368 K. In contrast, our corresponding UVC LED (sample B) only exhibited a Gaussian peak emission at a wavelength of approximately 272 nm.
In this paper, we report an AlN-based ceramic lead frame (LF) with encapsulating silicone between the surface of an AlGaN-based ultraviolet-B light-emitting diode (UVB-LED) chip and a quartz glass cover; the light output power (LOP) of this structure was 13.8% greater than that of the corresponding packaging structure without encapsulating silicone. Another packaging structure in which the silicone fully filled the cavity of the AlN-based ceramic LF included covering with quartz glass; in this case, the enhancement of the LOP was 11.7%. Reliability tests performed over a period of 3500 h at a forward current (If) of 100 mA revealed that the LOPs of these two silicone-containing packaging types decreased to 45.3 and 48.6%, respectively, of their initial values. The different degradation rates of these UVB-LEDs were not, however, correlated with the appearance of cracks in the encapsulating silicone during long-term operation. Excluding any possible mechanisms responsible for degradation within the UVB-LED chips, we suggest that the hermetic cover should be removed to avoid the appearance of cracks. Moreover, the main mechanism responsible for the slow degradation rates of LOPs in these proposed packaging structures involves the encapsulated silicone, after cracks have appeared, undergoing further deterioration by the UVB irradiation.
In this study we suppressed the parasitic emission caused by electron overflow found in typical UVB light-emitting diodes (LEDs). Furthermore, modulation of the p-layer structure and doping profile allowed us to decrease the relaxation time of the holes to reach conditions of quasi-charge neutrality in the UVB quantum well. Our UVB LED (sample A) exhibited a clear exciton emission, with its peak near 306 nm and a band-to-band emission at 303 nm. The relative intensity of the exciton emission of sample A decreased as a result of a thermal energy effect. At temperatures of up to 363 K, sample A displayed the exciton emission. Our corresponding UVC LED (sample B) exhibited only a Gaussian peak emission at a wavelength of approximately 272 nm.
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