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Abstract.A novel conductive adhesive is used to interconnect MEMS test structures with different pad sizes directly to a printed circuit board (PCB) in a medium caliber ammunition fuze. The fuze environment is very demanding, with a setback acceleration exceeding 60,000 g and a centripetal acceleration increasing radially with 9000 g/mm. The adhesive shows excellent mechanical and thermal properties. The mounted MEMS test structures perform well when subjected to rapid temperature cycling according to military-standard 883G method 1010.8 test condition B. The test structures pass 100 temperature cycles, followed by a firing test where the test structures are exposed to an acceleration of more than 60,000 g. C 2010 Society of Photo-Optical Instrumentation Engineers.

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