No abstract

Impact morphology and deformation of single splats were modelled through FEM simulations using PTW plasticity model to account for large strain rates.Annealing experiments and consequently formed interfacial intermetallics layer were investigated.Correlation of interfacial intermetallics pattern with highly strained interface area, predicted by modelling, present a new insight to the extent of particle/substrate metallurgical bonding. Metallurgical bonding of a particle/substrate is more likely to be found at peripheral areas of the interface which extends from there to the base of the particle with increase of kinetic energy of impacting particle.

No abstract

Cold Spray (CS) is a deposition process, part of the thermal spray family. In this method, powder particles are accelerated at supersonic speed within a nozzle; impacts against a substrate material triggers a complex process, ultimately leading to consolidation and bonding. CS, in its modern form, has been around for approximately 30 years and has undergone through exciting and unprecedented developmental steps. In this article, we have summarized the key inventions and sub-inventions which pioneered the innovation aspect to the process that is known today, and the key breakthroughs related to the processing of materials CS is currently mastering. CS has not followed a liner path since its invention, but an evolution more similar to a hype cycle: high initial growth of expectations, followed by a decrease in interest and a renewed thrust pushed by a number of demonstrated industrial applications. The process interest is expected to continue (gently) to grow, alongside with further development of equipment and feedstock materials specific for CS processing. A number of current applications have been identified the areas that the process is likely to be the most disruptive in the medium-long term future have been laid down.