The unconventional technology of wire electrical discharge machining is widely used in all areas of industry. For this reason, there is always an effort for efficient machining at the lowest possible cost. For this purpose, the following comprehensive study has been carried out to optimize the machining of the copper alloy Ampcoloy 35, which is particularly useful in plastic injection moulds. Within the study, a half-factor experiment of 25-1 with 10 axial points and seven central points of a total of 33 rounds was carried out, which was focused on the response monitoring of the input factors in the form of the machine parameters setup: gap voltage, pulse on time, pulse off time, discharge current, and wire speed. Based on the study of the response in the form of cutting speed and surface topography, their statistical models were created, while the optimal setting of machine parameters was determined to maximize the cutting speed and minimize the topography parameters. Further, a detailed cross-sectional analysis of surface and subsurface layer morphology was performed using electron microscopy including chemical composition analysis. In order to study microstructural changes in the material at the atomic level, a lamella was created, which was then studied using a transmission electron microscope.
Efficient machining using the technology of wire electrical discharge machining (WEDM) is a compromise between cutting speed and surface quality. Typical morphology of WEDM processed surface features plenty of craters caused by electrospark discharges produced during the cutting process. The study deals with the evaluation of S-parameters enabling quantitative evaluation of the surface in all directions which are technically significant. Attention was also paid to surface morphology and its evaluation using 3D colour-filtered and unfiltered images. The experiment included 33 variants of setting machine parameters on samples made of two metallic materials: Al 99.5 and Ti-6Al-4V.
The presented article focuses on measurements of extremely small dimensions in nanometrology using tactile probes. It addresses a newly developed method of precise measurements in nanometrology by touch probes, where the measurements are carried out on the machine SIOS NMM-1. The aim of this work is to determine accuracy of measurements on this machine. The main contribution of this work is a creation of a methodology for the measurement of precision parts and determination of accuracy of measurement when using this device in nanometrology. The work also includes methodology for the calculation of measurement uncertainty, a keystone in determining the accuracy of measurement in nanometrology. The article provides results of representative sets of measurements of ruby ball diameters, including the evaluation of statistical parameters and determination of the combined measurement uncertainty.
Our work focuses on process of software testing with the regard on his control and quality securing. Theoretical part explains basic terminology used later in our work. It explains the terms such as quality, process control management or software. Later our work describes software testing in relation with methodology of software development, quality improvement of process testing with the usage of model TMMi and modelling of processes.Project part consist of process analysis of current state of software testing process. Identified subprocesses are modelled and inserted into Process Cards. Identified imperfections are then subjects of solution proposal for improvement of software quality control testing process. Afterwares the proposal is implemented on the current state of software testing process with the goal to achieve second level of software testing process maturity according to model TMMi.
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