This article introduces McPAT, an integrated power, area, and timing modeling framework that supports comprehensive design space exploration for multicore and manycore processor configurations ranging from 90nm to 22nm and beyond. At microarchitectural level, McPAT includes models for the fundamental components of a complete chip multiprocessor, including in-order and out-of-order processor cores, networks-on-chip, shared caches, and integrated system components such as memory controllers and Ethernet controllers. At circuit level, McPAT supports detailed modeling of critical-path timing, area, and power. At technology level, McPAT models timing, area, and power for the device types forecast in the ITRS roadmap. McPAT has a flexible XML interface to facilitate its use with many performance simulators.Combined with a performance simulator, McPAT enables architects to accurately quantify the cost of new ideas and assess trade-offs of different architectures using new metrics such as Energy-Delay-Area 2 Product (EDA 2 P) and Energy-Delay-Area Product (EDAP). This article explores the interconnect options of future manycore processors by varying the degree of clustering over generations of process technologies. Clustering will bring interesting trade-offs between area and performance because the interconnects needed to group cores into clusters incur area overhead, but many applications can make good use of them due to synergies from cache sharing. Combining power, area, and timing results of McPAT with performance simulation of PARSEC benchmarks for manycore designs at the 22nm technology shows that 8-core clustering gives the best energy-delay product, whereas when die area is taken into account, 4-core clustering gives the best EDA 2 P and EDAP. . 2013. The mcpat framework for multicore and manycore architectures: Simultaneously modeling power, area, and timing. ACM Trans.

Temperature-induced reliability issues are among the major challenges for multicore architectures. Thermal hot spots and thermal cycles combine to degrade reliability. This research presents new reliability-aware job scheduling and power management approaches for chip multiprocessors. Accurate evaluation of these policies requires a novel simulation framework that can capture architecture-level effects over tens of seconds or longer, while also capturing thermal interactions among cores resulting from dynamic scheduling policies. Using this framework and a set of new thermal management policies, this work shows that techniques that offer similar performance, energy, and even peak temperature can differ significantly in their effects on the expected processor lifetime.

Recent proposals have employed optical circuit switching (OCS) to reduce the cost of data center networks. However, the relatively slow switching times (10-100 ms) assumed by these approaches, and the accompanying latencies of their control planes, has limited its use to only the largest data center networks with highly aggregated and constrained workloads. As faster switch technologies become available, designing a control plane capable of supporting them becomes a key challenge.In this paper, we design and implement an OCS prototype capable of switching in 11.5 µs, and we use this prototype to expose a set of challenges that arise when supporting switching at microsecond time scales. In response, we propose a microsecond-latency control plane based on a circuit scheduling approach we call Traffic Matrix Scheduling (TMS) that proactively communicates circuit assignments to communicating entities so that circuit bandwidth can be used efficiently.

No abstract

Temperature-induced reliability issues are among the major challenges for multicore architectures. Thermal hot spots and thermal cycles combine to degrade reliability. This research presents new reliability-aware job scheduling and power management approaches for chip multiprocessors. Accurate evaluation of these policies requires a novel simulation framework that can capture architecture-level effects over tens of seconds or longer, while also capturing thermal interactions among cores resulting from dynamic scheduling policies. Using this framework and a set of new thermal management policies, this work shows that techniques that offer similar performance, energy, and even peak temperature can differ significantly in their effects on the expected processor lifetime.