The Cu 2 O thin films were synthesized by using RF sputtering technique. Comparisons were made with films created by deposition at room temperature followed by thermal annealing between 100˚C and 400˚C and using different gases, oxygen (O 2 ) (oxidizing and reactive gas) and nitrogen (N 2 ) (inert gas), besides air. The thickness of the thin films was kept constant, around 2000 Å (Angstrom). In addition, the RF power and pressure deposition were kept constant, as well. The thin films were evaluated for a range of wavelengths between 200 nm and 400 nm (Ultra Violet spectrum), 400 nm and 700 nm (Visible spectrum), 700 nm and 800 nm (Infrared spectrum) for both, optical transmittance and photoluminescence. From the experimental results, the higher annealing temperature and the introduction of nitrogen (N 2 ) gas produced the following results: the optical bandgap for the Cu 2 O was found to be 2.23 eV and photoluminescence peaks were around 551 nm and 555 nm, which matched the theoretical analyses. Overall, there was a decrease in the optical bandgap of the Cu 2 O from 2.56 eV at room temperature to 2.23 eV for the film annealed in nitrogen gas at 400˚C. This indicates that the Cu 2 O is a potential candidate in solar cell applications.
The paper presents the virtual and real investigations related to the fusing of PCB traces in high power applications. The reason of performing the research and related tests is that in real applications the current carrying capacity of PCB traces is different than the value presented in standards and datasheets or obtained after solving thermal equations. Based on the experimental results, the authors want to offer a first practical resource in the case of traces/tracks fusing, in order to avoid failures of electronic systems during the operation and, why not, to offer a design guide of developing PCB fuses, which could be interesting in some specific or low cost applications. In addition, the contribution introduces finally a few "rules of thumb", useful to designers, fabricators and hardware engineers, which will deliver practice oriented advices for specialists involved in electronic design and manufacturing.
Along with the introduction of the new IPC-2152 standard came several questions: What has changed? How does this new standard affect the PCB design? Are the simulation programs up to date with the standard? And the most important: In practice, how close are we to the standard? In this research, we developed a series of tests to analyze the real thermal behavior of tracks when charged with different constant currents. We used boards with different thicknesses (FR4 0.8mm, FR4 1.6mm, FR2
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