Resonant body transistors (RBTs) are solid state, actively sensed microelectromechanical systems (MEMS) resonators that can be implemented in commercial CMOS technologies. With small footprint, high-Q, and scalability to gigahertz frequencies, they form basic building blocks for radio frequency (RF) front-ends and timing applications. Toward the goal of seamless CMOS integration, this paper presents the design and implementation of phononic crystals (PnCs) in the back-end-ofline (BEOL) of commercial CMOS technologies with bandgaps in the gigahertz frequencies to be used for enhanced acoustical confinement in CMOS-RBTs. Lithographically defined PnC dimensions allow for bandgap engineering, providing flexibility in resonator design, and allowing for multiple frequencies on a single chip. The theoretical basis for analyzing generic PnCs is presented, with focus on the special case of implementing PnCs in CMOS BEOL layers. The effect of CMOS process variations on the performance of such PnCs is also considered. The analysis presented in this paper establishes a methodology for assessing different CMOS technologies for the integration of unreleased CMOS-MEMS resonators. This paper also discusses the importance of uniformity of the acoustical cavity in the nonresonant dimension and its effect on overall resonator performance. A PnC implementation in IBM 32-nm silicon on insulator (SOI) BEOL layers is demonstrated to achieve 85% fractional-bandgap ∼4.5-GHz frequency. With better energy confinement, the proposed CMOS-RBTs achieve a quality factor Q of 252, which corresponds to 8× improvement over the previous generation RBTs, which did not include PnCs. The presented devices have a footprint of 5 μm × 7 μm. This paper concludes with a discussion of the properties required of a CMOS technology for high performance RBT implementation.[2014-0364] IndexTerms-CMOS-microelectromechanical systems (MEMS), radio frequenty (RF) MEMS, resonators, resonant body transistor (RBT), phononic crystals.
This work presents an unreleased CMOS-integrated MEMS resonators fabricated at the transistor level of IBM's 32SOI technology and realized without the need for any post-processing or packaging. These Resonant Body Transistors (RBTs) are driven capacitively and sensed piezoresistively using an n-channel Field Effect Transistor (nFET). Acoustic Bragg Reflectors (ABRs) are used to localize acoustic vibrations in these resonators completely buried in the CMOS stack and surrounded by low-k dielectric. Experimental results from the first generation hybrid CMOS-MEMS show RBTs operating at 11.1-11.5 GHz with footprints < 5µm × 3µm. The response of active resonators is shown to contrast with passive resonators showing no discernible peak. Comparative behavior of devices with design variations is used to demonstrate the effect of ABRs on spurious mode suppression. Temperature stability and TCF compensation due to complimentary materials in the CMOS stack are experimentally verified.
This work presents the first unreleased Silicon resonators fabricated at the transistor level of a standard CMOS process, and realized without any release steps or packaging. These unreleased bulk acoustic resonators are driven capacitively using the thin gate dielectric of the CMOS process, and actively sensed with a Field Effect Transistor (FET) incorporated into the resonant body. FET sensing using the high , high performance transistors in CMOS amplifies the mechanical signal before the presence of parasitics. This enables RF-MEMS resonators at orders of magnitude higher frequencies than possible with passive devices. First generation CMOS-MEMS Si resonators with Acoustic Bragg Reflectors are demonstrated at 11.1 GHz with ~17 and a total footprint of 5µm × 3µm using IBM's 32nm SOI technology.
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