We increased the absorptance of light by silicon to approximately 90% from the near ultraviolet (0.25 μm) to the near infrared (2.5 μm) by surface microstructuring using laser-chemical etching. The remarkable absorptance most likely comes from a high density of impurities and structural defects in the silicon lattice, enhanced by surface texturing. Microstructured avalanche photodiodes show significant enhancement of below-band-gap photocurrent generation at 1.06 and 1.31 μm, indicating promise for use in infrared photodetectors.
The spatially dependent de-excitation of a beam of metastable argon atoms, traveling through an optical standing wave, produced a periodic array of localized metastable atoms with position and momentum spreads approaching the limit stated by the Heisenberg uncertainty principle. Silicon and silicon dioxide substrates placed in the path of the atom beam were patterned by the metastable atoms. The de-excitation of metastable atoms upon collision with the surface promoted the deposition of a carbonaceous film from a vapor-phase hydrocarbon precursor. The resulting patterns were imaged both directly and after chemical etching. Thus, quantum-mechanical steady-state atom distributions can be used for sub-0.1-micrometer lithography.
We show that the near-unity infrared absorptance of conical microstructures fabricated by irradiating a Si(111) surface with 100 fs laser pulses depends on the ambient gas in which the structures are formed. SF6 produces an absorptance of 0.9 for radiation in the 1.2–2.5 μm wavelength range, higher than any of the other gases. Use of Cl2, N2, or air produces surfaces with absorptances intermediate between that for microstructures formed in SF6 and that for flat crystalline silicon, for which the absorptance is roughly 0.05–0.2 for a 260 μm thick sample. Secondary ion mass spectrometry shows that elements from the ambient gas are incorporated into the silicon surface in high concentration.
We report fabrication of regular arrays of silicon microspikes by femtosecond laser irradiation of a silicon wafer covered with a periodic mask. Without a mask, microspikes form, but they are less ordered. We believe that the mask imposes order by diffracting the laser beam and providing boundary conditions for capillary waves in the laser-melted silicon.
This letter describes the fabrication of ∼80 nm structures in silicon, silicon dioxide, and gold substrates by exposing the substrates to a beam of metastable argon atoms in the presence of dilute vapors of trimethylpentaphenyltrisiloxane, the dominant constituent of diffusion pump oil used in these experiments. The atoms release their internal energy upon contacting the siloxanes physisorbed on the surface of the substrate, and this release causes the formation of a carbon-based resist. The atomic beam was patterned by a silicon nitride membrane, and the pattern formed in the resist material was transferred to the substrates by chemical etching. Simultaneous exposure of large areas (44 cm2) was also demonstrated.
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