Single oxide films as well as complex oxide films are intensively studied for multi-chip modules with integrated passive functions. In this paper the processing and properties of oxide films such as Ta2O5, TiO2, Nb2O5, Ta2O5 -Al2O3, Ta2O5–Nb2O5 as well as complex oxide films such as BiNbO4 and Ba1划xSrxTiO3 films will be discussed with respect to their integration into thin film functional modules.
Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable System-in-Package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.
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