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High-intensity ultrasonication with a batch process was used to isolate fibrils from several cellulose sources, and a mixture of microscale and nanoscale fibrils was obtained. The geometrical characteristics of the fibrils were investigated with polarized light microscopy, scanning electron microscopy, and atomic force microscopy. The results show that small fibrils with diameters ranging from about 30 nm to several micrometers were peeled from the fibers. Some fibrils were isolated from the fibers, whereas some were still on the fiber surfaces. The lengths of untreated and treated cellulose fibers were investigated by a fiber size analyzer. The crystallinities of some cellulose fibers were evaluated by wide-angle X-ray diffraction and Fourier transform infrared spectroscopy. The high-intensity ultrasonication technique is an environmentally benign method and a simplified process that conducts fiber isolation and chemical modification simultaneously and helps significantly reduce the production cost of cellulose nanofibers and their composites.

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A mechanism of soldering of an aluminum alloy die casting to a steel die is proposed. A soldering critical temperature is postulated, at which iron begins to react with aluminum to form an aluminumrich liquid phase and solid intermetallic compounds. The liquid joins the die with the casting upon solidification. The critical temperature is determined by the elements in both the casting alloy and the die material and is equal to the solidus temperature of the resulting alloy. The critical temperature is used to predict the onset of die soldering, and the local liquid fraction is related to the soldering tendency. Experiments have been carried out to validate the concept and to determine the critical temperature for die soldering in an iron-aluminum system. Thermodynamic calculations are used to determine the critical temperature and soldering tendency for the cases of pure aluminum and a 380 alloy in a steel mold. Factors affecting the soldering tendency are discussed, and methods for reducing die soldering are suggested.