Physiochemical properties of tribofilms generated from octadecylthioperoxydiphosphate (SSC18) and octadecylphosphorofluoridothioate (PFC18) were compared with zinc dialkyl dithiophosphates (ZDDP) in this study. PFC18 and SSC18 were chemically synthesised and mixed in mineral base oil to prepare test oil formulations. Additionally, PFC18 and SSC18 were mixed at different concentrations and evaluated for their compatibility and tribological performance using high frequency reciprocating rig (HFRR) tribometer. All lubricant formulations with ashless additives exhibited superior anti-wear characteristics compared to ZDDP. Comprehensive surface analysis of tribofilms was conducted using scanning electron microscopy, nano-indentation and X-ray absorption near edge spectroscopy. Formulations containing only SSC18 and PFC18 exhibited a uniform and continuous tribofilm formation, while formulations with a combination of SSC18 and PFC18 had a stable pad-like structure. X-ray absorption near edge structure (XANES) results indicate ashless PFC18 and SSC18 by themselves and in combination form iron phosphate enriched tribofilms with a mixture of iron sulfides and/or sulfates.
The semiconductor industry presents a challenging production scenario by pushing the technology envelope of integrated circuit packaging. The demand for shrinking the geometry and introducing cost competitive materials and processing technology pose a constant learning and improvement opportunity for failure analysis labs. Mechanical cross sectioning technique has been in use in failure analysis labs since the 1950s. This technique provides the analyst with a wealth of information about the IC device such as the critical dimensions of each layer, layer structures, grain growth of various crystals in the layers, along with existence and confirmation of defects. Recent advances in Focused Ion Beam systems and cross section polishers have pushed sample preparation towards artifact free cross sections [1]. However, mechanical cross section still remains a reliable method, especially for large area cross sections. Many defects including shorts, delamination, ESD related defects, solder cracking, and non-wet issues, which can only be verified physically in cross section.
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