Pervasive computing and Internet of Things (IoTs) paradigms have created a huge potential for new business. To fully realize this potential, there is a need for a common way to abstract the heterogeneity of devices so that their functionality can be represented as a virtual computing platform. To this end, we present novel semantic level interoperability architecture for pervasive computing and IoTs. There are two main principles in the proposed architecture. First, information and capabilities of devices are represented with semantic web knowledge representation technologies and interaction with devices and the physical world is achieved by accessing and modifying their virtual representations. Second, global IoT is divided into numerous local smart spaces managed by a semantic information broker (SIB) that provides a means to monitor and update the virtual representation of the physical world. An integral part of the architecture is a resolution infrastructure that provides a means to resolve the network address of a SIB either using a physical object identifier as a pointer to information or by searching SIBs matching a specification represented with SPARQL. We present several reference implementations and applications that we have developed to evaluate the architecture in practice. The evaluation also includes performance studies that, together with the applications, demonstrate the suitability of the architecture to real-life IoT scenarios. In addition, to validate that the proposed architecture conforms to the common IoT-A architecture reference model (ARM), we map the central components of the architecture to the IoT-ARM.
The paper presents a novel and fast method to characterize the conformality of ultra-thin films on a microscopic 3D High Aspect Ratio substrate. The characterization method uses Lateral High Aspect Ratio (LHAR) test structures fabricated by common silicon surface micromachining. The silicon-based test chip, named PillarHall™ LHAR4 is used as a substrate for ALD thin film conformality characterization. In this paper, the film conformality is characterized as film penetration depth into the LHAR cavity by using optical microscopy and reference methods. The results show that the LHAR chip assisted method is fast and sensitive to characterize thin film conformality, also at a wafer-level.
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