The oxidation of copper single crystals is known to proceed at different rates on different crystal faces. To determine whether this behavior extends to subsequent atmospheric sulfidation as well, we have exposed polycrystalline copper and (100), (110), and (111) single crystals of copper to low concentrations of hydrogen sulfide in high humidity air. For short exposures, all of the single crystals sulfidize much more slowly than does polycrystalline copper. In each case,
Cu2S
is the predominant sulfur species formed. As with oxide formation on copper single crystals, there is a slight tendency for the (111) face to be the most inert. For long exposures, the sulfide film on the single‐crystal samples increases to become essentially equal to that on polycrystalline copper. We envision a corrosion process initially controlled by grain boundary diffusion (and thus the degree of crystallinity of the underlying oxide), followed by a transition to a regime in which the diffusion of copper ions through
Cu2S
limits the growth of the corrosion film.
(100), (110), and (111) single crystals of Cu and polycrystalline copper have been exposed to a controlled test atmosphere containing low concentrations of H2S, designed to simulate atmospheric sulfidation.
Expertmental observataons concerning the pop-m mode of fracture obtained during an investigation of the fracture toughness of glassy plastics are related. Comments on the mechanics of the pop-in mode are presented,
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