Surface Enhanced Raman Scattering (SERS) gives rise to analytical applications with much promise. In our approach three steps are necessary. We require a SERS platform of high enhancement. This has been achieved using the special technique of Island Lithography, combined with Ag deposition by galvanic exchange, yielding an enhancement factor of 10(8). Probe oligonucleotide molecules are attached to a specific area on the platform, at the optimized surface concentration, using thiolated single stranded (ss) DNA molecules. The optimum surface concentration has been determined and interpreted in the light of the polyelectrolyte behaviour of ssDNA. Finally the change in SERS produced by hybridisation of the probe molecules to a target DNA molecule is measured. Highly discernible changes have been obtained. No change in probe signal is seen when presented with one base mismatched target. From this work it is concluded that the prospects for label-free DNA detection in high-density arrays is now close to achievement.

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The chemical and physical properties of platinum (Pt) make it a useful material for microelectromechanical systems and microfluidic applications such as lab-on-a-chip devices. Platinum thin-films are frequently employed in applications where electrodes with high chemical stability, low electrical resistance or a high melting point are needed. Due to its chemical inertness it is however also one of the most difficult metals to pattern. The gold standard for patterning is chlorine RIE etching, a capital-intensive process not available in all labs. Here we present simple fabrication protocols for wet etching Pt thin-films in hot Aqua Regia based on sputtered Ti/Pt/Cr and Cr/Pt/Cr metal multilayers. Chromium (Cr) or titanium (Ti) is used as an adhesion layer for the Pt. Cr is used as a hard masking layer during the Pt etch as it can be easily and accurately patterned with photoresist and withstands the Aqua Regia. The Cr pattern is transferred into the Pt and the Cr mask later removed. Only standard chemicals and cleanroom equipment/tools are required. Prior to the Aqua Regia etch any surface passivation on the Pt is needs to be removed. This is usually achieved by a quick dip in dilute hydrofluoric acid (HF). HF is usually also used for wet-etching the Ti adhesion layer. We avoid the use of HF for both steps by replacing the HF-dip with an argon (Ar) plasma treatment and etching the Ti layer with a hydrogen peroxide (H 2 O 2) based etchant.

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