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A novel oxime ligand has been synthesized by refluxing 3,3'-diaminobenzedine and phthalaldehyde monoxime. Copper (II), cobalt (II), nickel (II) and manganese (II) binuclear complexes of this ligand have been prepared and characterized by using elemental analysis, molar conductance studies, IR, UV, NMR, EPR and magnetic studies. The molar conductance measurements correspond to a non-electrolytic nature for all complexes which can be formulated as [M2(L)X4] (Where M = Cu(II), Ni(II), Co(II) and Mn(II); X = Cl − ). The UV-visible spectra of all the complexes are well characterized by broad weak d-d band and a high intensity charge-transfer transition. Thermal studies supported the chemical formation of these complexes showed that they decomposed in three or four stages depending on the type of ligand. The far-IR spectrum confirms the presence of coordinate chloride ion in all the complexes as evidenced by one intense far IR bands around 310-330 cm −1 . In electrochemical studies the resulting cyclic voltammogram consists of single quasi-reversible one electron transfer. The ligand and complexes have been screened for their antimicrobial activity against two Gram-positive bacteria, two Gram-negative bacteria and fungi. The binuclear metal complexes were found to possess potent antimicrobial, antifungal activity better than ligand alone.Schiff base Binuclear Oxime Cyclic voltammetry 3,3'-Diaminobenzedine Microbial activity

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New binucleating Cu(II), Ni(II), Mn(II), Zn(II) and VO(II) complexes of the prepared ligands with N4 donor were synthesized. The ligands are obtained by the condensation of paraphenylenediamine with diacetylmonoxime and benzilmonoxime. The synthesized ligands and their metal complexes were characterized by elemental analysis and various spectroscopic techniques. The Cu(II), Ni(II) complexes were square planar, VO(II) complex was square pyramidal, whereas Mn(II), Zn(II) complexes were of tedrahedral geometry. Both the ligands and their metal complexes were screened for their antibacterial and antifungal activities by minimum inhibitory concentration method. The results showed that the metal complexes were found to be more active than free ligand. The DNA binding capacities of all the complexes were analyzed by using UV absorption spectra. The DNA cleaving capacities of all complexes were analyzed by agarose gel electrophoresis method against pBR322 DNA. KEYWORDS

The effect of cutting performance was investigated using uncoated plain andtextured tungsten carbide tools in dry machining of carbon steel. Texture namely straight line,zigzag and plus profiles was created on flank face of the uncoated tungsten carbide tool. This textured tool was designed and fabricated by Neodymium-doped Yttrium Aluminium Garnet ND-YAG laser machine. Also it was evident with scanning electron microscopy analysis. In further design of experiment was carried by taguchi method by using L9 orthogonal array for varying cutting speed, feed rate, depth of cut to perform the machining experiment. The cutting force,surface roughness and cutting temperature were measured in which it depicts that microscale textured tools improves the machining characteristics to a greater extent when compared with untextured tool. It can be effective in all manufacturing industries provide an eco friendly environment since no coolant is required due to which it becomes pollution free.

Friction Stir welding is a solid state joining process with no filler material. In this work, we specifically investigated the Tool Pin Profile, Tool Material, Base Material and the process parameters in the Aluminum metal matrix composites especially reinforced with Zirconium diboride (Al–ZrB2 . Tools of Various Materials and the corresponding tensile strength of the weld specimen, microstructure analysis and Hardness test are evaluated. Threaded Cylinder made of various materials are OHNS, HCHCr, H13 tools are carried out in the process with D/d Ratio are used. The result will be stated with the Threaded Cylinder pin with which tool material provides highest strength to the Bas material.

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