A new condenser microphone with a 300 nm thick monocrystalline silicon and silicon nitride sandwich diaphragm and an aluminum backplate fabricated using a sacrificial resist layer, is presented and tested. Microphones with diaphragm side lengths of 200 to 476 pm show a flat frequency response between 50 HZ and 20 kHz and sensitivities up to 0,35 mVPa at a bias voltage of 2V. The microphones can be fabricated on a single wafer without bonding techniques. The technology is suitable for integration of a CMOS signal processing electronic circuit.
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