Laser powder bed fusion (L-PBF) of copper alloys with high copper content is difficult due to the high infrared reflectivity and thermal conductivity of these alloys. In this study a simple and scalable method for coating copper powder with tin and nickel is presented, and suggested as an alloying strategy for such alloys. The coated powders were processed in a commercial L-PBF-machine at various scanning speeds. The samples made from coated powders show a lower amount of porosity compared to samples made from in-situ alloyed powders of similar composition.
International audienceInterfacial reaction between solid e-Cu3Sn compound and liquid Sn at 250 °C is studied for the first time. The reaction product formed at the e-Cu3Sn/liquid Sn interface consists of the single g-Cu6Sn5 phase. The growth kinetics of the g phase formed at the incremental e/liquid Sn couple (e/g/Sn configuration) is compared to that of g phase formed at the classical Cu/liquid Sn couple (Cu/e/g/Sn configuration). The experimental method con- sists first in processing of intimate interfaces by dipping peaces of solid e-Cu3Sn compound and Cu in liquid Sn for 1 s at 250 °C. Afterwards, isothermal holding of such pre- performed couples for 10, 30, 120 and 480 min at 250 °C are performed for both couples. A theoretical analysis of the growth kinetics of g phase and comparison of its in both configurations are performed
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