Novel concept of unencapsulated modules was developed for avoiding many degradation phenomena originating from encapsulants, for reducing material costs, and also for both easy repair of cells and easy recycle of modules. Reliability and durability of the novel concept modules were investigated using damp-heat (DH) test, thermal-cycle (TC) test, and sequential test composed of DH and TC tests. No large reduction in maximum power after DH test for 2700 h or TC test for 1000 cycles was observed for unencapsulated modules regardless of cell-connection methods, cell spacing, and existence of intentional microcracks. However, unstable contact between interconnector ribbons and busbar electrodes was found after TC test due to thermomechanical stress. Superiority of shingling connection was suggested for novel concept of unencapsulated modules.
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