BackgroundAlthough several recent reports have shown that hepatocellular carcinoma (HCC) developed in patients with chronic hepatitis C (CH-C) even after having a sustained virological response (SVR) to interferon (IFN) therapy, it is not common for HCC to develop more than 10 years after SVR.Case presentationA 73-year-old Japanese man with CH-C who achieved SVR to IFN therapy 13 years ago was admitted into our hospital because of huge multiple liver tumors along with marked elevation of the tumor markers. Several diagnostic modalities strongly suggested HCC, and we performed histopathological examination. After confirming the diagnosis as well-differentiated HCC, we successfully treated these tumors with intensive combination therapies.ConclusionOur report highlights the need for careful follow-up for more than 10 years even if the patients with CH-C achieve SVR to IFN therapy.
Recently, the semiconductor substrates for integrated circuits (ICs) have been required to become as thin as 50 jim, because the many electronic devices are strongly demanded to be miniaturized and light-weighted. Machining of such thin substrates with conventional dicing techniques is very difficult. Therefore, we have proposed to process them using femtosecond laser ablation, expecting advantage of efficient etching without undesirable mechanical and thermal damages such as cracking and melting is expected. In this work, we have investigated the influence of the laser conditions such as pulse duration and fluence on the cutting depth and diameter in order to develop a new photo-dicing technique for very thin ICs. Within the range of pulse energy used in the present experiments, the dependence of the pulse duration did not seem to be significant. It was also found that the lower energy ofthe laser pulses, the smaller and the deeper, i.e., the sharper holes were formed. The typical cutting depth and diameter for 0.20 mJ/pulse and 5 shots were 17 jim and 40 jim, respectively. These values are very promising for the practical dicing applications.
We are developing applications of femtosecond-laser ablation to the practical material processing such as cutting, drilling, dicing and turning. In this work, we have observed the morphology of ablation traces formed on the surfaces of various materials to investigate the influence of physical properties of work materials on the machining preciseness. Ti:sapphire laser pulses (2 790 nm, r= 160 fs, f'= 10 Hz, E = 0.6 1.2 mJ/pulse) were focused on the samples, insulators (silica glass and PMMA), semiconductor (Si), and metals (Cu and Al), fixed on a PC-controlled X-Y stage and moved one-dimensionally at a scan rate of 5.5 111 pm/sec. Grooves with well-defmed edge were observed on the insulators which have low thermal conductivity. In the case of the metallic materials having relatively high thermal conductivity, molten walls were observed near the edge of the grooves. It is considered that mainly thermal conductivity plays an important role in characteristics of the ablation morphology.
Several 2-(benzylsulfonyl)tropones were thermolized to give 2- and 4-benzyltropones. The radical mechanism for the thermolysis was elucidated by a deuterium-labelling experiment.
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