In this study, cathodic arc electron / metal ion treatment (CA-EMIT) technique was used to modify Ti surfaces in Ni cathodic arc plasma. At this novel method, AC bias was applied to the Ti substrates. In positive cycle of AC bias, the substrates were heated by electrons while nickel ions were directed toward the substrate surface in negative cycle. The surface modification processes were performed at 5 different temperatures: 1073 K (800 °C), 1273 K (1000 °C), 1373 K (1100 °C), 1473 K (1200 °C) and 1573 (1300 °C). The samples were characterized by XRD, SEM and EDS analysis. The effect of substrate temperature and cathode current were investigated on microstructure of the samples. This process provides rapid diffusion of nickel into the titanium and high diffusion depths were obtained compared to literature studies.
We investigated the anode performance of Cu-Sn flat thin film. The results show that the presence of copper improves the cycleability of the thin film since the mechanical tolerance of the thin film against the stress generated during the high volumetric changes in lithiation/delithiation processes is increased. However, some improvement in the microstructure of the thin film is still required to minimize the quantity or the sizes of Sn particles in thin film and facilitate lithium movements in thin film structure.
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