Using an advanced ultraviolet irradiation (UV curing) process, a high performance porous low-k film of k ¼ 2:57, whose Young's modulus is larger than 8 GPa, now is developed to improve the mechanical properties of a film by the reconstruction of Si-O network structure from cage-like Si-O bonds, suboxide structures and Si-CH 3 bonds. It was found that the UV curing process can efficiently strengthen the mechanical properties of porous low-k film, and reduce its dielectric constant value by removing hydrocarbon bonds to form porosities. As a result, the key features of this optimal SiOCH material, high elastic modulus and a low dielectric constant, provide promising properties for future integrated schemes.
The purpose of this study is to reduce the glass substrate reflectivity over a wide spectral range (400-1200 nm) without having high reflectivity in the near-infrared region. After making porous SiO₂/MgF₂ double-layer antireflection (DLAR) thin film structure, the superstrate-type silicon-based tandem cells are added. In comparison to having only silicon-based tandem solar cells, the short-circuit current density has improved by 6.82% when porous SiO₂/MgF₂ DLAR thin film is applied to silicon-based tandem solar cells. This study has demonstrated that porous SiO₂/MgF₂ DLAR thin film structure provides antireflection properties over a broad spectral range (400-1200 nm) without having high reflectivity at near-infrared wavelengths.
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